This article originates from the financial industry

On February 28, 2025, the financial sector reported that the China National Intellectual Property Administration information showed that STMI had obtained a patent named "integrated circuit packaging", with the authorization announcement number of CN 222530415 U and the application date of February 2024.

The patent abstract shows that the present utility model relates to an integrated circuit package, comprising an integrated circuit device, having a first side with an optical sensor and a first electrical connection pad, and an opposite second side; Optical components installed on the first side to extend above the sensor; The main body of LDS encapsulation material, which encapsulates integrated circuit devices and optical components, has first and second surfaces that are coplanar with the upper surface and second side of the optical components, respectively; The main body includes an activation trace area at the first surface, a first activation via opening extending from the first surface through the main body to the second surface, and a second activation via opening extending from the first surface into the main body to the first electrical connection pad; The first conductive wire is located at the activation trace area; The first conductive via is electrically connected to the first conductive line at the openings of the first and second activated vias; The first passivation layer covers a portion of the first conductive line, the first surface, and the optical component; The second passivation layer covers the second surface and the second side surface; And the redistribution layer.